HIGH DENSITY ELECTRONICS CENTER

The High Density Electronics Center (HiDEC) was established in 1991 as an interdisciplinary research program in advanced electronic packaging technologies, particularly the rapidly developing technology of Multichip Modules (MCMs), which allows electronic systems to be smaller, faster, and cheaper. With generous support from the Advanced Research Projects Agency (ARPA), a large clean room was constructed and an MCM fabrication facility, unique among universities, was installed.

Current research programs focus on High Temperature Superconducting (HTSC) MCMs, synthetic diamond substrates for MCMs, and cost reduction methods for conventional MCMs. The program involves faculty from six departments, and over 20 graduate students. Continuing funding comes from ARPA and several industrial sponsors. Significant national recognition has resulted from HiDEC work.